Diaphragm valves, valve components, and methods for forming valve components

ABSTRACT

A diaphragm valve is disclosed. The diaphragm valve may include, a valve body comprising a valve channel, the valve channel including an inlet channel and an outlet channel. The diaphragm valve may also include, a valve seat adjacent to the valve channel and a flexible diaphragm comprising a wetted surface and an opposing non-wetted surface, the flexible diaphragm being disposed adjacent to the valve channel. The diaphragm valve may also include, a flexible heater disposed over the non-wetted surface of the flexible diaphragm, and a valve actuator that is operable to operable to move the wetted surface of the flexible diaphragm into and out of contact with the valve seat. Valve components including a flexible heater and methods for forming such valve components are also disclosed.

FIELD OF INVENTION

This application is a Divisional of, and claims priority to and the benefit of, U.S. patent application Ser. No. 16/036,692, filed Jul. 16, 2018 and entitled “DIAPHRAGM VALVES, VALVE COMPONENTS, AND METHODS FOR FORMING VALVE COMPONENTS,” which is hereby incorporated by reference herein.

FIELD OF INVENTION

The present disclosure relates generally to a diaphragm valve and in particular, a diaphragm valve comprising a valve component including an integrated flexible heater. The present disclosure also generally related to methods for forming valve components including an integrated flexible heater.

BACKGROUND OF THE DISCLOSURE

Semiconductor processing apparatuses commonly use one or more reactants, i.e., precursors, as source chemicals for performing substrate processes, such as, for example, deposition, cleaning, and etching processes. Such semiconductor processing apparatuses frequently comprise a reaction chamber into which the precursors are supplied in order to perform the desired process. The supply of the precursor to the reaction chamber may be performed by a precursor delivery system and such precursor delivery systems may utilize one or more valves to control the flow of precursor to the reaction chamber.

A precursor delivery system may utilize one or more diaphragm valves positioned in a flow path between a source vessel of the precursor and the reaction chamber to enable flow control of the precursor into the reaction chamber. Precursors, such as vapor phase precursors, may be pulsed into a reaction chamber by the opening and closing of an appropriate diaphragm valve in the precursor delivery system. Diaphragm valves may comprise an actuator configured for opening and closing a flexible diaphragm against a valve seat. When the diaphragm valve is in the open position, the precursor is allowed to pass through a valve channel and enter the reaction chamber. When the diaphragm valve is in the closed position, the diaphragm obstructs the valve channel and prevents the precursor from entering the reaction chamber.

An example of a semiconductor processing apparatus that may utilize a precursor delivery system comprising one or more diaphragm valves is an atomic layer deposition (ALD) apparatus. ALD is a method of depositing thin films on a substrate comprising sequential and alternating self-saturating surface reactions wherein one or more vapor phase precursors may be pulsed into the ALD reaction chamber to enable film deposition. ALD processes may require precise temperature control of the precursors, not only in the reaction chamber, but also in the precursor delivery system utilized to provide the precursor to the reaction chamber. In particular precise temperature of the wetted surfaces of the precursor delivery system, i.e., those surfaces in direct contact with the precursor, may be desired for optimal film deposition and apparatus lifetime.

The wetted surfaces making up the precursor delivery system may include the internal wetted surfaces of the diaphragm valve. For example, if the wetted surfaces of the diaphragm valve exceed the operational temperature window for a particular precursor then the precursor may decompose within the diaphragm valve prior to entering the reaction chamber. Conversely, if the wetted surfaces of the diaphragm valve are below the operational temperature window for a particular precursor, then the precursor may condense or even solidify in the valve channel causing the diagram valve to leak or even blocking the valve channel. Accordingly, a diaphragm valve incorporating means for precise temperature control over the internal wetted surfaces of the diaphragm valve is highly desirable.

SUMMARY OF THE DISCLOSURE

This summary is provided to introduce a selection of concepts in a simplified form. These concepts are described in further detail in the detailed description of example embodiments of the disclosure below. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

In some embodiments of the disclosure, a diaphragm valve is provided. The diaphragm valve may comprise: a valve body comprising a valve channel, the valve channel including an inlet channel and an outlet channel; a valve seat adjacent to the valve channel; a flexible diaphragm comprising a wetted surface and an opposing non-wetted surface, the flexible diaphragm being disposed adjacent the valve channel; a flexible heater disposed over the non-wetted surface of the flexible diaphragm; and a valve actuator that is operable to move the wetted surface of the flexible diaphragm into and out of contact with the valve seat.

In some embodiments of the disclosure, a valve component is provided. The valve component may comprise: a flexible diaphragm comprising a wetted surface and an opposing non-wetted surface; and a flexible heater disposed over the non-wetted surface of the flexible diaphragm.

In some embodiments of the disclosure, methods for forming a valve component may be provided. The method may comprise: providing a flexible diaphragm, the flexible diaphragm comprising a wetted surface and an opposing non-wetted surface; and forming a flexible heater over the non-wetted surface of the flexible diaphragm.

For the purpose of summarizing the invention and the advantages achieved over the prior art, certain objects and advantages of the invention have been described herein above. Of course, it is to be understood that not necessarily all such objects or advantages may be achieved in accordance with any particular embodiment of the invention. Thus, for example, those skilled in the art will recognize that the invention may be embodied or carried out in a manner that achieves or optimizes one advantage or group of advantages as taught or suggested herein without necessarily achieving other objects or advantages as may be taught or suggested herein.

All of these embodiments are intended to be within the scope of the invention herein disclosed. These and other embodiments will become readily apparent to those skilled in the art from the following detailed description of certain embodiments having reference to the attached figures, the invention not being limited to any particular embodiment(s) disclosed.

BRIEF DESCRIPTION OF THE DRAWING FIGURES

While the specification concludes with claims particularly pointing out and distinctly claiming what are regarded as embodiments of the invention, the advantages of embodiments of the disclosure may be more readily ascertained from the description of certain examples of the embodiments of the disclosure when read in conjunction with the accompanying drawings, in which:

FIG. 1 is a cross-sectional schematic diagram of an exemplary diaphragm valve in the open position according to the embodiments of the disclosure;

FIG. 2 is a cross-sectional schematic diagram of an exemplary diaphragm valve in the closed position according to the embodiments of the disclosure;

FIGS. 3A, 3B and 3C illustrate perspective views of methods for forming a valve component comprising a flexible diaphragm, an integrated flexible heater, and an integrated flexible temperature sensor, wherein the flexible heater and flexible temperature sensor are disposed directly on the flexible diaphragm;

FIGS. 4A, 4B and 4C illustrate perspective views of methods for forming a valve component comprising a flexible diaphragm, an integrated flexible heater, and an integrated flexible temperature sensor, wherein the flexible heater and the flexible temperature are formed on an intermediate flexible substrate and subsequently bonded to the flexible diaphragm;

FIGS. 5A, 5B and 5C illustrate perspective views of methods for forming a valve component comprising a flexible diaphragm, an integrated flexible heater, and an integrated flexible temperature sensor, wherein the flexible heater and the flexible temperature sensor are formed on an upper surface of an intermediate flexible substrate and subsequently bonded to the flexible diaphragm;

FIGS. 6A, 6B and 6C illustrate perspective views of methods for forming a valve component comprising a flexible diaphragm, an integrated flexible heater, and an integrated flexible temperature sensor, wherein the flexible heater and the flexible temperature sensor are formed on separate flexible substrates and subsequently bonded to the flexible diaphragm;

FIGS. 7A, 7B and 7C illustrate further perspective views of methods for forming a valve component comprising a flexible diaphragm, an integrated flexible heater, and an integrated temperature sensor, wherein the flexible heater and the flexible temperature sensor are formed on separate flexible substrates and subsequently bonded to the flexible diaphragm; and

FIG. 8 illustrates an exemplary semiconductor processing apparatus including a precursor delivery system comprising one or more diaphragm valves according to the embodiments of the disclosure.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Although certain embodiments and examples are disclosed below, it will be understood by those in the art that the invention extends beyond the specifically disclosed embodiments and/or uses of the invention and obvious modifications and equivalents thereof. Thus, it is intended that the scope of the invention disclosed should not be limited by the particular disclosed embodiments described below.

The illustrations presented herein are not meant to be actual views of any particular material, apparatus, structure, or device, but are merely idealized representations that are used to describe embodiments of the disclosure.

As used herein, the term “substrate” may refer to any underlying material or materials that may be used, or upon which, a device, a circuit or a film may be formed.

As used herein, the term “atomic layer deposition” (ALD) may refer to a vapor deposition process in which deposition cycles, preferably a plurality of consecutive deposition cycles, are conducted in a process chamber. Typically, during each cycle the precursor is chemisorbed to a deposition surface (e.g., a substrate surface or a previously deposited underlying surface such as material from a previous ALD cycle), forming a monolayer or sub-monolayer that does not readily react with additional precursor (i.e., a self-limiting reaction). Thereafter, if necessary, a reactant (e.g., another precursor or reaction gas) may subsequently be introduced into the process chamber for use in converting the chemisorbed precursor to the desired material on the deposition surface. Typically, this reactant is capable of further reaction with the precursor. Further, purging steps may also be utilized during each cycle to remove excess precursor from the process chamber and/or remove excess reactant and/or reaction byproducts from the process chamber after conversion of the chemisorbed precursor. Further, the term “atomic layer deposition,” as used herein, is also meant to include processes designated by related terms, such as “chemical vapor atomic layer deposition,” “atomic layer epitaxy” (ALE), molecular beam epitaxy (MBE), gas source MBE, or organometallic MBE, and chemical beam epitaxy when performed with alternating pulses of precursor composition(s), reactive gas, and purge (e.g., inert carrier) gas.

As used herein, the term “chemical vapor deposition” may refer to any process wherein a substrate is exposed to one or more volatile precursors, which react and/or decompose on a substrate surface to produce a desired deposition.

As used herein, the term “wetted surface” may refer to surface of a valve which may come into direct contact with a chemical precursor.

As used herein, the term “non-wetted surface” may refer to a surface of a valve which may not come into direct contact with a chemical precursor.

In the specification, it will be understood that the term “on” or “over” may be used to describe a relative location relationship. Another element or layer may be directly on the mentioned layer, or another layer (an intermediate layer) or element may be intervened therebetween, or a layer may be disposed on a mentioned layer but not completely cover a surface of the mentioned layer. Therefore, unless the term “directly” is separately used, the term “on” or “over” will be construed to be a relative concept. Similarly to this, it will be understood the term “under,” “underlying,” or “below” will be construed to be relative concepts.

The embodiments of the disclosure may include diaphragm valves, valve components, and related methods for forming valve components. In particular, the embodiments of the disclosure provide a diaphragm valve which incorporates a flexible heater disposed over the non-wetted surface of the diaphragm, the flexible heater allowing for the precise temperature control over the wetted surface of the diaphragm. For example, the diaphragm valve of the current disclosure may be utilized as a component part of a precursor delivery system employed to deliver one or more precursors to the reaction chamber of a deposition apparatus, such as, for example, an ALD apparatus, whereby the diaphragm valve of the current disclosure may result in film deposition with reduced defectivity. Furthermore, the diaphragm valve of the current disclosure may increase the operational lifetime (i.e., “up time”) of a semiconductor processing apparatus as well reducing the time period between maintenance cycles.

Current technologies for heating a diaphragm valve and particular heating the diaphragm of the diaphragm valve may comprise an external heater, such as, for example, a block heater disposed directly adjacent to the body of the diaphragm valve. The external heater provides thermal energy to the body of the diaphragm valve, which is conducted through the body of the diaphragm valve to the diaphragm situated within the body of the diaphragm valve. However, such indirect external methods for heating the diaphragm of the diaphragm valve may result in temperature non-uniformities of the wetted internal surfaces of the diaphragm valve. For example, an external heater may be utilized to heat the diaphragm of the diaphragm valve to the operational temperature of a particular precursor; however, due to temperature non-uniformities, other wetted regions of the diaphragm valve may be outside the operational temperature window of the precursor, resulting in either precursor decomposition or condensation within the diaphragm valve.

Therefore, the embodiments of the disclosure provide a diaphragm valve comprising: a valve body comprising a valve channel, the valve channel including an inlet channel and an outlet channel; a valve seat disposed adjacent to the valve channel; a flexible diaphragm comprising a wetted surface and an opposing non-wetted surface, the flexible diaphragm being disposed adjacent to the valve channel; a flexible heater disposed over the non-wetted surface of the flexible diaphragm; and a valve actuator that is operable to move the wetted surface of the flexible diaphragm into and out of contact with the valve seat.

FIGS. 1 and 2 illustrate cross-sectional schematic diagrams of an exemplary diaphragm valve in accordance with the embodiments of the disclosure. It should be noted that the diaphragm valve of FIGS. 1 and 2 is a non-limiting example configuration for a diaphragm valve incorporating a valve component comprising a flexible heater and alternative configurations of a diaphragm valve may be envisioned that may incorporate the flexible heater of the current disclosure. It should also be noted that FIGS. 1 and 2 illustrate simplified cross-sectional diagrams of an exemplary diaphragm valve demonstrating the key features of the diaphragm valve needed for understanding the embodiments of the disclosure.

In more detail, FIG. 1 illustrates a cross-sectional illustration of an exemplary diaphragm valve 100 in the open position, i.e., a valve channel 102 disposed between an inlet channel 104 and an outlet channel 106 is unobstructed by a flexible diaphragm 108, thereby allowing precursor to flow freely through the diaphragm valve 100. FIG. 2 illustrates a cross-sectional illustration of the exemplary diaphragm valve 100 in the closed position, i.e., the valve channel 102 disposed between an inlet channel 104 and an outlet channel 106 is obstructed by the flexible diaphragm 108, thereby preventing a precursor from flowing through the diaphragm valve 100. The exemplary diaphragm valve 100 may comprise an actuator 110 connected to a valve body 112 via an annular nut 114.

In more detail, the valve body 112 may comprise a valve channel 102 including an inlet channel 104 and an outlet channel 106. The inlet channel 104 may be fluidly connected to a source vessel (not illustrated) containing a suitable precursor. For example, the source vessel may contain a precursor in a solid phase, a liquid phase, a vapor phase, or mixtures thereof. In embodiments wherein the precursor is in the solid phase or liquid phase, the source vessel may also include means for converting the precursor to a vapor phase precursor, such as, for example, one or more heaters. The outlet channel 106 may be fluidly connected to a reaction chamber of a semiconductor processing apparatus. For example, the reaction chamber may be utilized for one or more deposition processes, etching process, and/or cleaning processes. In particular embodiments of the disclosure, the outlet channel 106 may be fluidly connected to a reaction chamber of a semiconductor deposition apparatus, such as, for example, an atomic layer deposition (ALD) apparatus or a chemical vapor deposition (CVD) apparatus.

A valve seat 114 may be disposed adjacent to the valve channel 102 and may surround the upper portion of the inlet channel 104. The valve seat 114 includes an upper surface 116 that presents a sealing surface against which a wetted surface 118 of the flexible diaphragm 108 is pressed against in order to close the valve channel 102. The upper surface 116 of the valve seat 114 may be polished or otherwise made smooth to reduce contact resistance and to reduce leakage of precursor between the valve seat 114 and the flexible diaphragm 108 when the flexible diaphragm 108 is in the closed positioned, as illustrated in FIG. 2. Although the upper surface 116 of the valve seat 114 is illustrated as a planar surface in FIGS. 1 and 2, alternative sealing surfaces for the upper surface 116 may be utilized. For example, upper surface 116 of the valve seat 114 may include a seating ridge that extends upwardly from the upper surface 116 towards the flexible diaphragm 108, wherein the seating ridge may be sufficiently prominent and sized to deform the wetted surface 118 of the flexible diaphragm 108 when the flexible diaphragm 108 is pressed against the valve seat 114.

Disposed within the valve body 112 is a valve component 122, the valve component 122 comprising a flexible diaphragm 108 and a flexible heater 124. The flexible heater 124 as illustrated in FIGS. 1 and 2 is shown in a simplified block form and is described in greater detail herein below. The flexible diaphragm 108 may comprise a wetted surface 118, i.e., a surface which may come into direct contact with a precursor flowing through the diaphragm valve 100, and a non-wetted surface 120, i.e., a surface that may not come into direct contact with a precursor flowing through the diaphragm valve 100. The flexible diaphragm 108 may be disposed adjacent to the valve channel 102 and may be secured to the valve body 112 at a rim 126. The valve component 122 further comprises a flexible heater 124, where the flexible heater 124 may be disposed over the non-wetted surface 120 of the flexible diaphragm 108. Further details regarding the valve component 122 and methods for forming the valve component are disclosed herein below.

The diaphragm valve 100 further comprises an actuator 110 that may be operable to move a surface of the flexible diaphragm 108 into and out of contact with the valve seat 114 to thereby open and close the valve channel 102. In more detail, the actuator 110 may comprise an actuator stem 128 and optionally a contact button 130 that contacts the upper surface of the flexible heater 124, which is coupled to the flexible diaphragm 108. The actuator 110 may include a number of actuating mechanisms including, but not limited to, pneumatic, hydraulic, and piezoelectric mechanisms. In some embodiments, the actuator 110 may include a solenoid (not shown) that can be energized by the application of an electric current to drive actuator stem 128 to transmit force to the flexible diaphragm 108 to enable the opening and closing of the valve channel 102 by the action of driving the actuator stem 128 into and out of contact with the flexible heater 124 coupled to the flexible diaphragm 108.

The exemplary diaphragm valve 100 may also include additional heaters 132, which may be disposed external to the valve body and/or disposed within the valve body itself but outside of the wetted stream of the precursor. For example, the one or more heaters 132 may comprise resistive heaters disposed directly adjacent to the valve body 112.

The embodiments of the disclosure may be utilized to ensure the thermal uniformity of the wetted surfaces of the diaphragm valve 100, wherein the wetted surfaces may include those internal surfaces of the diaphragm valve 100, which may come into direct contact with a precursor flowing through the diaphragm valve and may include: the wetted surfaces of the valve channel 102 (including inlet channel 104 and outlet channel 106), the wetted surfaces of the valve seat 114, and the wetted surface 118 of the diaphragm 108. The embodiments of the disclosure may be utilized to provide a thermal uniformity, i.e., the differential temperature between the maximum temperature and minimum temperature of the wetted surfaces of the diaphragm valve 100, within a temperature range of approximately less than 1° C., or approximately less than 0.5° C., or even less than 0.25° C. The temperature uniformity of the wetted surfaces of the diaphragm valve may be achieved by utilizing one or more external heaters and an internal flexible heater adjoined to the diaphragm of the diaphragm valve.

The valve component 122 comprises at least a flexible diaphragm 108 and a flexible heater 124. Exemplary valve components and methods for forming the exemplary valve components are is described in more detail with reference to FIGS. 3A-3C, FIGS. 4A-4C, FIGS. 5A-5C, FIGS. 6A-6C, and FIGS. 7A-7C.

An exemplary valve component and methods for forming the exemplary valve component are illustrated with reference to FIGS. 3A-3C, which illustrates perspective views of embodiments wherein the flexible heater is disposed directly on the non-wetted surface of the flexible diaphragm.

In more detail, the valve component may comprise a flexible diaphragm 308 as illustrated in FIG. 3A. The flexible diaphragm 308 may comprise a wetted surface 318 and an opposing non-wetted surface 320. The flexible diaphragm 308 may be formed of a flexible plastic, elastomeric material, a metal, or a metal alloy. In some embodiments of the disclosure, the flexible diaphragm 308 may be formed of a thin, molded disc of a plastic material, such as, for example, polytetrafluoroethylene (“PTFE”) or polyvinylidene fluoride (“PVDF”). In some embodiments, the flexible diaphragm 308 may be formed of an elastomeric material, such as, for example, a fluoroelastomer, ethylene propylene diene monomer (“EPDM”), silicone rubber, nitrile rubber, chloroprene rubber (neoprene), natural rubber, or perfluorinated elastomers. In some embodiments, the flexible diaphragm may comprise a metal alloy or laminate of metal alloys, such as Hastelloy alloys, for example.

A flexible heater may be formed over the non-wetted surface of the flexible diaphragm as illustrated by the flexible heater 324 in FIG. 3B. The flexible heater 324 may be disposed directly over the non-wetted surface 320 of the flexible diaphragm 308. The flexible heater 324 may comprise a flexible printed heater comprising one or more electrically conductive traces. For example, the electrically conductive traces making up the heating element of the flexible heater 324 may be composed of an electrically conductive ink. The configuration, i.e., the layout, of the electrically conductive traces of flexible heater 324 shown in FIG. 3B is a potential non-limiting example layout of the conductive traces, and alternative configurations can be envisioned depending on the thermal profile desired for heating the flexible diaphragm 308. In addition to the electrical conductive traces, two or more contact pads 334 may be formed over the non-wetted surface 320 of the diaphragm 308, the contact pads 334 being in electrical contact with the conductive traces of the flexible heater 324 to allow for electrical connection to the flexible heater 324. As illustrated in FIG. 3B, the flexible heater 324 comprises a single printed heating element, however it may be desirable to have two or more printed heating elements (with associated contact pads), which may be independently controlled for improved thermal control of the diaphragm 308.

The electrical traces of the flexible heater 324 may be formed by a printing process. For example, the flexible printed heater may be formed by an additive manufacturing process, more commonly referred to as three-dimensional (3D) printing. Additive manufacturing or 3D printing technologies create physical objects from 3D data, typically by providing, curing, or fusing material in a layer-by-layer manner. Additive manufacturing technologies include, but are not limited to, extrusions based 3D printing, stereolithography, selective laser sintering (SLS), multi jet modelling, binder-on-powder 3D printing, laminated object manufacturing, and other technologies.

In some embodiments, the flexible heater 324 may be formed by a 3D printing process and the electrically conductive traces of the heating element may be built-up of one or more conductive inks, such as, for example, at least one of aluminum, silver, carbon, nichrome, nickel, chrome, or tungsten. The electrically conductive traces of the flexible heater 324 may be 3D printed to a thickness of greater than 0.25 millimeters, or greater than 0.50 millimeters, or even greater than 1 millimeter, with a cross-sectional line width of less than 3 millimeters, or less than 2 millimeters, or even less than 1 millimeter. In embodiments wherein the flexible diaphragm comprises a metallic material, an insulating dielectric material may be 3D printed prior to the electrically conductive traces to provide electrical isolation of the electrically conductive traces. For example, an insulating dielectric, such as an alumina, may be 3D printed directly onto the surface of the flexible diaphragm and the 3D printed electrically conductive traces may be 3D printed directly over the insulating dielectric.

The embodiments of the current disclosure are not limited to 3D printing methods for forming the flexible heater 324 and alternative printing methods may be utilized to form the electrically conductive traces of the flexible heater 324, such as screen printing or inkjet printing, for example. The ability to print the electrically conductive traces of the flexible heater 324 permits the formation of a flexible heater with a high power density. For example, the flexible heater 324 may provide a power density of at least 100 watts per square inch, or a power density of at least 200 watts per square inch, or even a power density of at least 400 watts per square inch, wherein the power density of the heater may be limited by the thermal properties of the flexible diaphragm 308, i.e., excess heating of the flexible diaphragm may deform or otherwise negatively impact the integrity of the flexible diaphragm 308.

To add further functionality to the valve component and particularly to add further thermal control over the diaphragm, a flexible temperature sensor may also be integrated into the valve component. For example, FIG. 3B illustrates a flexible temperature sensor 336 disposed over the non-wetted surface 320 of the flexible diaphragm 320. In particular embodiments, the flexible temperature sensor 336 may be disposed directly over the non-wetted surface 320 of the flexible diaphragm 308.

In some embodiments, the flexible temperature sensor 336 may comprise a flexible printed thermocouple. The flexible printed thermocouple may include a first printed thermocouple element 338 comprising a first metal-containing ink and a second printed thermocouple element 340 comprising a second metal-containing ink, the first printed thermocouple element being in electrical contact with the second printed thermocouple element thereby forming a thermocouple junction. The first metal-containing ink and the second metal-containing ink may comprise two different metal species with sufficiently different Seebeck coefficients to produce a thermocouple effect. As non-limiting examples, to produce a reproducible temperature signal, the two metal-containing inks species may comprise silver-nickel, or tungsten-nickel. In some embodiments, the first printed thermocouple element 338 and the second thermocouple element 340 may be printed by a 3D printing process, a screen printing process, or an inkjet printing process, as previously described herein. The flexible temperature sensor 336 may also comprise contact pads 342 to enable electrical contact to the flexible temperature sensor 336. In embodiments wherein the flexible diaphragm comprises a metallic material, an insulating dielectric may be printed directly over the non-wetted surface of the flexible diaphragm prior to printing the flexible temperature sensor to enable electrical isolation of the flexible temperature sensor from the metallic flexible diaphragm.

The valve component may further comprise a flexible substrate disposed over the flexible heater and if present over the flexible temperature sensor. In more detail, FIG. 3C illustrates a perspective view of an exemplary valve component 322 comprising the flexible diaphragm 308, the flexible heater 324, and the flexible temperature sensor 336 disposed directly over the non-wetted surface 320 of the flexible diaphragm 308, and a flexible substrate 344 disposed over the flexible heater 324 and the flexible temperature sensor 336. In particular embodiments the flexible substrate 344 may be disposed directly over the flexible heater 324 and the flexible temperature sensor 336. The flexible substrate 344 is illustrated in FIG. 3C as a transparent substrate however in some embodiments the flexible substrate may be opaque, the flexible substrate 344 is shown in transparent form for this exemplary valve component 322 to illustrate the positional relationships between the various elements of the valve component 322.

The flexible substrate 344 may be adjoined to the non-wetted surface 320 of the flexible diaphragm 308 to form a capping layer over the flexible heater 324 and the optional flexible temperature sensor 336. For example, when the valve component 322 is driven into the closed position, as illustrated in FIG. 2, the actuator stem 128 and optionally a contact button 130 may come into direct contact with the upper surface of the flexible heater to enable deformation of the flexible diaphragm thereby closing the valve passage 102. The flexible substrate 344 is therefore disposed over the flexible heater 324 and the optional flexible temperature sensor 336 to ensure that the actuator stem (or optional contact button) does not directly contact the flexible heater which could result in an electrical short and wear of the flexible heater through repeated contact with the actuator mechanism.

In some embodiments of the disclosure, the flexible substrate 344 may be formed of a thin, molded disc of a plastic material, such as, for example, polytetrafluoroethylene (“PTFE”) or polyvinylidene fluoride (“PVDF”). In some embodiments, the flexible substrate 344 may be formed of an elastomeric material, such as, for example, a fluoroelastomer, ethylene propylene diene monomer (“EPDM”), silicone rubber, nitrile rubber, chloroprene rubber (neoprene), natural rubber, or perfluorinated elastomers. In some embodiments of the disclosure, the flexible substrate 344 may comprise a polyimide substrate.

In some embodiments of the disclosure, the flexible substrate 344 may comprise a flexible spin-on-dielectric material, such as, for example, poly(methyl methacrylate) (PMMA). For example, a solution consisting of a solvent containing the PMMA polymer may be disposed directly over the non-wetted surface 320 of the flexible diaphragm 308 which includes the flexible heater 324 and optionally the flexible temperature sensor 336. The flexible diaphragm with the PMMA solution thereon is then spun to distribute the PMMA over the entire surface of the non-wetted surface 320 of the flexible diaphragm 308 covering both the flexible heater 324 and the optional flexible temperature sensor 336. The PMMA may then be post spin baked to drive off excess solvent thereby forming a flexible substrate 344 which seals the non-wetted surface 320 of the flexible diaphragm 308 with the flexible heater 324 and flexible temperature sensor 336 thereon.

In some embodiments of the disclosure, the flexible substrate 344 may be adjoined to the flexible diaphragm 308 by the application of adhesive between the bonding surfaces of the flexible substrate 344 and the flexible diaphragm 308.

In some embodiments of the disclosure, the flexible substrate 344 may be adjoined to the non-wetted surface 320 of the flexible diaphragm 308 utilizing a bonding process, thereby forming a bonding interface 348 disposed between the lower surface of the flexible substrate 344 and the non-wetted surface 320 of the flexible diaphragm 308. For example, the bonding process may comprise placing the lower surface of the flexible substrate 344 in contact with the non-wetted surface 320 of the flexible diaphragm 308 and applying pressure between the flexible substrate 344 and the flexible diaphragm 308 while applying heat to assembly comprising the flexible substrate 344 and the flexible diaphragm 308. In some embodiment, the assembly comprising the flexible substrate 344 and the flexible diaphragm 308 maybe be placed into a bonding apparatus and pressure may be applied while heating the assembly to a temperature of approximately less than 250° C., thereby bonding the flexible substrate 344 to the flexible diaphragm 308 and thereby forming a bonding interface 348 disposed between the bottom surface of the flexible substrate 344 and the non-wetted surface 320 of the flexible diaphragm 308.

It should be noted that prior to forming the flexible substrate over the flexible diaphragm and particular over the flexible heater and optional flexible temperature sensor, two or more electrical connections may be made to the flexible heater 324 by the connecting electrical wiring to bond pads 334, likewise electrical connection may be made to the flexible temperature sensor 336 by connecting electrical wiring to bond pads 342.

Therefore, as illustrated in FIG. 3C the completed valve component 322 comprises a flexible diaphragm 308 with a flexible heater 324 and a flexible temperature sensor 336 disposed directly on the non-wetted surface 320, i.e., both the flexible heater 324 and the flexible temperature sensor 336 are disposed upon the same surface. The valve component 322 may further comprise, a flexible substrate 344 disposed directly over the non-wetted surface 320 of the flexible diaphragm 308 thereby sealing the flexible heater 324 and the flexible temperature sensor 336. The valve component 322 may be utilized in the exemplary diaphragm valve 100 of FIGS. 1 and 2 to provide improved thermal control over the internal wetted surfaces of the diaphragm valve 100.

In alternative embodiments, the flexible heater and optional flexible temperature sensor may be formed over an intermediate flexible substrate and subsequent adjoined to the non-wetted surface of the flexible diaphragm. In more detail, FIG. 4A illustrates a flexible intermediate substrate 446, which comprises a flexible heater 424 and an optional flexible temperature sensor 436 formed over an upper surface of the flexible intermediate substrate 446. The flexible intermediate substrate 446 may comprise a flexible plastic or an elastomeric material, as previously described herein. In some embodiments, the flexible intermediate substrate 446 may comprise a polyimide material. Both the flexible heater 424 and the optional flexible temperature sensor 436 may be formed on the upper surface of the flexible intermediate substrate 446 by one or more printing processes as previously described herein. In embodiments wherein the flexible diaphragm comprises a metallic material, an insulating dielectric layer may be printed over the upper surface both flexible heater 424 and the flexible temperature to provide subsequent electrical isolation form the metallic diaphragm.

The flexible intermediate substrate 446 with the flexible heater 424 and the optional flexible temperature 436 disposed thereon is then inverted, as shown in FIG. 4B, and adjoined to the non-wetted surface 420 of the flexible diaphragm 408. For example, the inverted flexible intermediate substrate 446 with the flexible heater 424 and optional flexible temperature 436 disposed thereon may be adjoined to the non-wetted surface 420 of the flexible diaphragm 408 by applying an adhesive to one or more of the non-wetted surface 420 of the flexible diaphragm 408 and/or the surface of the flexible intermediate substrate 446 including the flexible heater 424 and optional flexible temperature sensor 436. The assembly comprising the flexible diaphragm 408 and the flexible intermediate substrate 446 may then be subjected to pressure to induce bonding between the flexible diaphragm 408 and the flexible intermediate substrate 446.

In alternative embodiments of the disclosure, the flexible intermediate substrate 446 may be adjoined to the non-wetted surface 420 of the flexible diaphragm 408 by a bonding process. For example, the surface of the flexible intermediate substrate 446 including the flexible heater 424 and the optional flexible temperature sensor 436 may be placed in direct contact with the non-wetted surface 420 of the flexible diaphragm 408 and through the application of pressure and heat, as previously described herein, a bonding interface 448 may be formed between the bottom surface of the flexible intermediate substrate 446 and the non-wetted surface 420 of the flexible diaphragm 408 thereby resulting in the valve component 422 of FIG. 4C.

As illustrated in FIG. 4C, the completed valve component 422 comprises, the flexible diaphragm 408 bonded directly to flexible intermediate substrate 446 via the bonding interface 448, the flexible heater 424, and the optional flexible temperature sensor 436 being disposed over the non-wetted surface 420 of the flexible diaphragm 408. In this exemplary embodiment, the flexible intermediate substrate 446 comprises a capping layer over the flexible heater 424 and the optional flexible temperature sensor 436 thereby protecting the flexible heater 424 and the flexible temperature sensor 436 from direct contact with the actuating mechanism of the diaphragm valve 100 of FIGS. 1 and 2.

In additional embodiments of the disclosure, the flexible heater and optional flexible temperature sensor may be formed over an upper surface of a flexible intermediate substrate and subsequent adjoined to the non-wetted surface of the flexible diaphragm. In more detail, FIG. 5A illustrates a flexible intermediate substrate 546 which comprises a flexible heater 524 and an optional flexible temperature sensor 536 formed over an upper surface of the flexible intermediate substrate 546. The flexible intermediate substrate 546 may comprise a flexible plastic or an elastomeric material, as previously described herein. In some embodiments, the flexible intermediate substrate 546 may comprise a polyimide material. Both the flexible heater 524 and the optional flexible temperature sensor 536 may be formed on the upper surface of the flexible intermediate substrate 546 by one or more printing processes as previously described herein.

As opposed to the previous embodiment (as illustrated in FIGS. 4A-4C), in this particular embodiment the flexible intermediate substrate 546 is not inverted but rather the lower surface of the flexible intermediate substrate 546, i.e., the surface of the flexible intermediate substrate 546 not including the flexible temperature 524 and the optional flexible temperature, is adjoined to the non-wetted surface 520 of the flexible diaphragm 508. For example, the flexible intermediate substrate 546 may be adjoined to the non-wetted surface 520 of the flexible diaphragm 508 by utilizing an adhesive process or a bonding process, as described previously herein.

Upon adjoining the flexible intermediate substrate 546 to the non-wetted surface 520 of the flexible diaphragm 508 a transitional structure 560 (FIG. 5B) is formed which comprises the flexible diaphragm 508 with the flexible intermediate substrate 546 disposed thereon with a bonding interface 548 disposed between the non-wetted surface 520 of the flexible diaphragm 508 and the lower surface of the flexible intermediate substrate 546. The upper surface of the transitional structure 560 comprises the flexible heater 524 and the optional flexible temperature sensor 536.

To complete the exemplary valve component an additional flexible substrate may be formed over the upper surface of the transitional structure 560 to thereby form a protective capping layer over the flexible heater and the option flexible temperature. In more detail, FIG. 5C illustrates a perspective view of an exemplary valve component 522 comprising the flexible diaphragm 508 with a flexible intermediate substrate 546 disposed thereon. A first bonding interface 548 may be disposed between the lower surface of the flexible intermediate substrate 546 and the non-wetted surface 520 of the flexible diaphragm 508. Disposed over the flexible intermediate substrate 546 is an additional flexible substrate 550. The additional flexible substrate 550 may be adjoined to the flexible intermediate 546 substrate by an adhesive process or a bonding process, as previously described herein. In some embodiments, the additional flexible substrate 550 may comprise a flexible spin-on-dielectric as previously described herein. A second bonding interface 552 may be disposed between a lower surface of the additional flexible substrate 550 and the flexible intermediate substrate 546. The additional flexible substrate 550 may therefore form a capping layer over the flexible heater 524 and the optional flexible temperature sensor 536 thereby protecting the flexible heater 524 and the optional flexible temperature 536 from direct interaction with the actuating mechanism of the diaphragm valve 100 of FIGS. 1 and 2.

In further embodiments of the disclosure, the flexible heater and the flexible temperature sensor may be formed over different substrates to allow further flexibility in the design layout of the flexible heater and the flexible temperature sensor. Therefore, in some embodiments of the disclosure, the flexible heater and the flexible temperature may be disposed upon different surfaces.

In more detail, FIG. 6A illustrates a flexible intermediate substrate 646 with a flexible temperature sensor 636 disposed thereon. As with previous embodiments, the flexible intermediate substrate 646 may be formed of a flexible plastic or elastomeric material (e.g., a polyimide material) and the flexible temperature sensor 636 may be formed over the upper surface of the flexible intermediate substrate 646 utilizing one or more printing processes. The flexible intermediate substrate 646 may then be inverted and adjoined to a transitional structure 660, as illustrated in FIG. 6B. The transitional structure 660 may comprise a flexible diaphragm 608, a flexible substrate 644 disposed over the non-wetted surface of the diaphragm 608, and a flexible heater 624 disposed over the upper surface of the flexible substrate 644. Finally, the transitional structure 660 may comprise an additional flexible substrate 650 disposed over the flexible heater 624. The flexible intermediate substrate 646 comprising the flexible temperature sensor 646 disposed on a lower surface (once inverted) may be adjoined to the transitional structure 660 by an adhesive process or bonding process as described previously herein.

FIG. 6C illustrates the exemplary valve component 622 after bonding the flexible intermediate substrate 646 to the transitional structure 660. The exemplary valve component 622 comprises, a flexible heater 624 and a flexible temperature sensor 636 disposed on different substrates of the exemplary valve component 622. For example, the exemplary valve component 622 comprises a flexible diaphragm 608 with a flexible substrate 644 disposed over the non-wetted surface of the flexible diaphragm 608. The flexible substrate 644 comprises a flexible heater 624 disposed over an upper surface. Disposed over the flexible substrate 644 is an additional flexible substrate 650 which caps and protects the flexible heater 624 and disposed over the flexible substrate 650 is flexible intermediate substrate 646 including the flexible temperature sensor 636 disposed on a lower surface of the flexible intermediate substrate 646. The inverted flexible intermediate substrate 646 provides a capping protective layer to the flexible temperature sensor 636 such that the flexible temperature sensor 636 does not come into direct contact with the actuating mechanism of the exemplary diaphragm valve of FIGS. 1 and 2.

In further embodiments of the disclosure, the flexible heater and the flexible temperature sensor may be disposed over different substrates to allow a further degree of freedom in the design and layout of the flexible heater and the flexible temperature sensor. In more detail, FIG. 7A illustrates a flexible intermediate substrate 746 with a flexible temperature sensor 736 disposed thereon. As with previous embodiments, the flexible intermediate substrate 746 may be formed of a flexible plastic or elastomeric material and the flexible temperature sensor 736 may be formed over the surface of the flexible intermediate substrate 746 utilizing one or more printing process. In this exemplary embodiment, the flexible intermediate substrate 746 is not inverted but rather the lower surface of the flexible intermediate substrate 746, i.e., the surface which does not have a flexible temperature sensor disposed thereon, is adjoined to a transitional structure 760 as illustrated in FIG. 7A. In this exemplary process, the transitional structure 760 comprises a flexible diaphragm 708 with a flexible substrate 744 disposed over the non-wetted surface of the flexible diaphragm 708 wherein the flexible substrate 744 includes a flexible heater 724 disposed over an upper surface. The lower surface of flexible intermediate substrate 746 may adjoined to the upper surface of the transitional structure 760 by either an adhesive process or bonding processes, as previously described herein forming a bonding interface 748 disposed between the lower surface of the flexible intermediate substrate 746 and the upper surface of the transitional structure 760, as illustrated in FIG. 7B.

To complete the valve component an additional flexible substrate 750 may be disposed over the flexible temperature sensor 736 as illustrated in FIG. 7C, thereby protecting the flexible temperature 736 and ensuring the flexible temperature sensor does not come into direct contact with the actuating mechanism of the exemplary diaphragm valve 100 of FIGS. 1 and 2.

The completed valve component 722 of FIG. 7C therefore comprises, a diaphragm 708 with a flexible substrate 744 disposed over the non-wetted surface of the diaphragm 708, the flexible substrate 744 comprising a flexible heater 724 disposed over an upper surface. Disposed over the flexible heater 724 is the flexible intermediate substrate 746 which includes a flexible temperature sensor 736 disposed over an upper surface, and finally an additional flexible substrate 750 disposed over and protecting the flexible temperature sensor 736.

The exemplary valve components and methods for forming the valve components described herein are non-limiting and it is envisioned that the formation methods and valve component elements, such as the flexible diaphragm, flexible substrates, flexible heaters, and flexible temperature sensors, may be combined in alternative arrangements.

The diaphragm valves of the current disclosure may be utilized in a number of applications. As a non-limiting example, the exemplary diaphragm valves of the current disclosure may be utilized as components of a precursor delivery system configured for supplying one or more precursor to a reaction chamber of a semiconductor processing apparatus.

In more detail, FIG. 8 illustrates an exemplary semiconductor processing apparatus 800 which comprises a reaction chamber 802 and a precursor delivery system 812. The precursor delivery system 812 may be configured for supplying precursor(s) to the reaction chamber 802 employing the diaphragm valves of the current disclosure to enable flow control of the precursors. It should be noted that the semiconductor processing apparatus 800 is a simplified schematic version of an exemplary semiconductor processing apparatus and does not contain each and every element, i.e., such as each and every valve, gas line, heating element, and reactor component, etc. The semiconductor processing apparatus 800 of FIG. 8 provides the key features of the apparatus to provide sufficient disclosure to one of ordinary skill in the art.

The exemplary semiconductor processing apparatus 800 may comprise a reaction chamber 802 constructed and arranged to hold at least a substrate 804. In some embodiments, the reaction chamber 802 may be configured for one or more of a deposition process, an etching process, or a cleaning process. For example, the reaction chamber 802 may be configured for atomic layer deposition (ALD) processes, or chemical vapor deposition (CVD) processes. The substrate 804 may be disposed in the reaction chamber 802 and held in position by a susceptor 808 configured to retain at least one substrate thereon. The susceptor may comprise a heater 810 configured to heat the substrate to a suitable process temperature.

The precursor delivery system 812 may comprise one or more precursor sources 814A and 814B constructed and arranged to provide a vapor phase precursor to the reaction chamber 802. For example, the precursor sources 814A and 814B may comprise a solid precursor, a liquid precursor, a vapor precursor, or mixtures thereof. The precursor delivery system 812 may also comprise a source vessel 814C configured for storing and dispensing a purge gas to the reaction chamber 802.

The precursor delivery system 812 may comprise a number of diaphragm valves, such as, for example, diaphragm valves 822A, 822B, and 822C, configured to enable control over the flow the precursors and the purge gas to the reaction chamber 802. The diaphragm valves 822A, 822B, and 822C, may include the diaphragm valves of the current disclosure and may therefore include an integrated flexible heater and optionally a flexible temperature sensor. In addition, the diaphragm valves 822A, 822B, and 822C, may further comprise one or more external heaters (shown as heaters 132 in FIGS. 1 and 2) either disposed within the valve body or directly adjacent to the valve body. The combination of an internal flexible heater and the external heater(s) may allow for precise temperature control over the wetted surfaces of the diaphragm valves, thereby preventing decomposition or condensation of the precursor flowing through the diaphragm valves. For example, the differential temperature between the maximum temperature and minimum temperature of the wetted surfaces of the diaphragm valves 822A, 822B, and 822C, may span a temperature range of approximately less than 1° C., or approximately less than 0.5° C., or even less than 0.25° C.

In addition to the diaphragm valves, the precursor delivery system 812 may further comprise flow controllers 820A, 820B, and 820C, configured for monitoring and regulating the mass flow of the precursors and purge gas into the reaction chamber 802. For example, the flow controllers 820A, 820B, and 820C may comprise mass flow controllers (MFCs).

One or more gas lines, such as gas lines 824, 826, and 828, may be in fluid communication with both the precursor/purge sources and the reaction chamber 802 to enable the supply of vapors to the reaction chamber 802. In particular embodiments, the precursor delivery system 812 may be in fluid communication with a gas dispenser 832 configured for dispensing precursor vapor and purge gas into the reaction chamber 802 and over the substrate 804. As a non-limiting example, the gas dispenser 832 may comprise a showerhead as illustrated in block form in FIG. 8. It should be noted that the although shown in block form, the showerhead may be a relatively complex structure and may configured for either mixing vapors from multiple sources, or maintaining a separation between multiple vapors introduced into the showerhead.

The exemplary semiconductor processing apparatus 800 may also comprise a gas removal system constructed and arranged to remove gases from the reaction chamber 802. For example, the removal system may comprise an exhaust port 834 disposed within a wall of the reaction chamber 802, an exhaust line 836 in fluid communication with the exhaust port 834, and a vacuum pump in fluid communication with the exhaust line 836 and configured for evacuating gases from within the reaction chamber 802. Once the gases have been exhausted from the reaction chamber 802 utilizing the vacuum pump 838, the gases may be conveyed along additional exhaust line 840 and exit the apparatus 100 for further abatement processes.

The exemplary semiconductor processing apparatus 800 may further comprising a sequence controller 842 operably connected to the precursor delivery system 812, the reaction chamber 802, and the removal system by means of exemplary control lines 844A, 844B, and 844C. The sequence controller 842 may comprise electronic circuitry to selectively operate valves, heaters, flow controllers, manifolds, pumps and other equipment associated with the semiconductor processing apparatus 800. Such circuitry and components operate to introduce precursor gases and purge gases from sources 814A, 814B, and 814C. The sequence controller 842 may also control the timing of precursor pulse sequences, temperature of the substrate and reaction chamber, and the pressure of the reaction chamber and various other operations necessary to provide proper operation of the semiconductor processing apparatus 800. The sequence controller 842 may also comprise a memory 844 provided with a program to execute semiconductor processes when run on the sequence controller 842. For example, the sequence controller 842 may include modules such as software or hardware components (e.g., FPGA or ASIC) which perform certain semiconductor processes, such as etching processes, cleaning processes, and/or deposition processes, for example. A module can be configured to reside on an addressable storage medium of the sequence controller 842 and may be configured to execute one or semiconductor processes.

In particular embodiments, the sequence controller 842 may be connected (either electrically and/or optically) to the diaphragm valves 822A, 822B, and 822C, to enable thermal control and thermal monitoring of the diaphragm valves. For example, the sequence controller may be connected to both the internal flexible heater and the external heater(s) associated with each diaphragm valve thereby enabling independent temperature control over both the internal flexible heater and the external heater(s). In addition, the flexible temperature sensor that may be associated with each diaphragm valve may provide a temperature feedback signal to sequence controller 842 such that both a set-point temperature and minimum differential temperature may be maintained by the internal wetted surfaces of the diaphragm valves 822A, 822B, and 822C.

The example embodiments of the disclosure described above do not limit the scope of the invention, since these embodiments are merely examples of the embodiments of the invention, which is defined by the appended claims and their legal equivalents. Any equivalent embodiments are intended to be within the scope of this invention. Indeed, various modifications of the disclosure, in addition to those shown and described herein, such as alternative useful combination of the elements described, may become apparent to those skilled in the art from the description. Such modifications and embodiments are also intended to fall within the scope of the appended claims. 

What is claimed is:
 1. A method for forming a valve component, comprising: providing a flexible diaphragm, the flexible diaphragm comprising a wetted surface and an opposing non-wetted surface; and forming a flexible heater over the non-wetted surface of the flexible diaphragm.
 2. The method of claim 1, wherein forming the flexible heater further comprises printing the flexible heater over the non-wetted surface of the flexible diaphragm utilizing one or more conductive inks.
 3. The method of claim 2, further comprising printing the flexible heater directly over the non-wetted surface of the flexible diaphragm.
 4. The method of claim 1, further comprising forming a flexible substrate over the flexible heater.
 5. The method of claim 2, further comprising printing the flexible heater over a surface of a flexible intermediate substrate and bonding a lower surface of the flexible intermediate substrate to the non-wetted surface of the flexible diaphragm.
 6. The method of claim 5, further comprising forming an additional flexible substrate over the flexible intermediate substrate.
 7. The method of claim 1, further comprising forming a flexible temperature sensor over the non-wetted surface of the flexible diaphragm.
 8. The method of claim 7, where forming the flexible temperature sensor further comprises printing a flexible printed thermocouple comprising a first printed thermocouple element comprising a first metal-containing ink and a second printed thermocouple element comprising a second metal-containing ink, the first printed thermocouple element being in electrical contact with the second printed thermocouple element thereby forming a thermocouple junctions.
 9. The method of claim 7, wherein the flexible heater and the flexible temperature are printed upon the same surface.
 10. The method of claim 7, wherein the flexible heater and the flexible temperature are printed upon different surfaces. 